Plate type: Positive-working digital thermal offset plate<>Min. plate width: 200 mm<>Max. plate width: 1250 mm<>Min. plate length: 300 mm<>Plate thickness: 0.15 - 040 mm<>Platesetters: 830nm Thermal Platesetters<>Plate speed: 160 cm/min.<>Plate throughput: 95 plates/h (landscape)<>Plate throughput: 67 plates/h (portrait)<>Processor sections<>The basis processor contains four major sections:<>1 Developer Developing of the plate and removing of the remaining unexposed/-<>exposed emulsion.<>2 Wash Washing off the developer chemicals from the developed plate.<>3 Gum Application of a thin layer of gum onto the developed and washed plate to<>protect it from oxidation, dirt, fingerprints etc.<>4 Dryer Drying of the plate to ensure immediate handling of the plate.